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Vertically Integrated System with Microfabricated 3D Sensors and CO2 Microchannel Cooling (2021)

First Author: Da Via C

Attributed to: ATLAS Upgrade R&D 2016 funded by STFC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.3389/fphy.2021.633970

Publication URI: http://dx.doi.org/10.3389/fphy.2021.633970

Type: Journal Article/Review

Parent Publication: Frontiers in Physics