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Thermal response of multi-layer UV crosslinked PEGDA hydrogels (2022)

First Author: Khalili M

Attributed to: Molecular dynamic based novel manufacturing methods for next generation of silicon wafers funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.polymdegradstab.2021.109805

Publication URI: http://dx.doi.org/10.1016/j.polymdegradstab.2021.109805

Type: Journal Article/Review

Parent Publication: Polymer Degradation and Stability