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Phase field study of grain boundary migration and preferential growth in non-magnetic materials under magnetic field (2022)

First Author: Liang S

Attributed to: Quasi-ambient bonding to enable cost-effective high temperature Pb-free solder interconnects funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.mtcomm.2022.103408

Publication URI: http://dx.doi.org/10.1016/j.mtcomm.2022.103408

Type: Journal Article/Review

Parent Publication: Materials Today Communications