A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints (2022)

First Author: Xu Y
Attributed to:  High reliability Interconnects: New Methodologies for Lead-free Solders funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.ijplas.2022.103308

Publication URI: http://dx.doi.org/10.1016/j.ijplas.2022.103308

Type: Journal Article/Review

Parent Publication: International Journal of Plasticity