Insight into Atomic-Scale Adhesion at the C-Cu Interface During the Initial Stage of Nanoindentation (2022)
Attributed to:
A hybrid precision manufacturing platform for next-generation of nanoscale products
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1007/s41871-022-00149-3
Publication URI: http://dx.doi.org/10.1007/s41871-022-00149-3
Type: Journal Article/Review
Parent Publication: Nanomanufacturing and Metrology
Issue: 3