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Multi-scale plasticity homogenization of Sn-3Ag-0.5Cu: From ß-Sn micropillars to polycrystals with intermetallics (2022)

First Author: Xu Y

Attributed to: High Reliability Interconnects: New Methodologies for Lead-free Solders funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.msea.2022.143876

Publication URI: http://dx.doi.org/10.1016/j.msea.2022.143876

Type: Journal Article/Review

Parent Publication: Materials Science and Engineering: A