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A Correlative Study of Interfacial Segregation in a Cu-Doped TiNiSn Thermoelectric half-Heusler Alloy (2022)

First Author: Halpin J

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1021/acsaelm.2c00699

PubMed Identifier: 36185076

Publication URI: http://europepmc.org/abstract/MED/36185076

Type: Journal Article/Review

Parent Publication: ACS Applied Electronic Materials

Issue: 9

ISSN: 2637-6113