Microstructural and mechanical characteristics of Cu-Sn intermetallic compound interconnects formed by TLPB with Cu-Sn nanocomposite (2022)

First Author: Jiang H
Attributed to:  Underpinning Power Electronics 2017: Heterogeneous Integration funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.mtcomm.2022.104623

Publication URI: http://dx.doi.org/10.1016/j.mtcomm.2022.104623

Type: Journal Article/Review

Parent Publication: Materials Today Communications