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Hybrid integration of chipscale photonic devices using accurate transfer printing methods (2022)

First Author: Smith J

Attributed to: Zero-change manufacturing of photonic interconnects for silicon electronics funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1063/5.0121567

Publication URI: http://dx.doi.org/10.1063/5.0121567

Type: Journal Article/Review

Parent Publication: Applied Physics Reviews

Issue: 4