Direct Write 3D-Printed Interconnects for Heterogenous Integration of Ultra Thin Chips (2022)

First Author: Ma S
Attributed to:  Engineering Fellowships for Growth: Printable Tactile Skin funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/fleps53764.2022.9781596

Publication URI: http://dx.doi.org/10.1109/fleps53764.2022.9781596

Type: Conference/Paper/Proceeding/Abstract