Bonding with Zn-based solders through self-propagating exothermic reaction to enable high-temperature electronics packaging (2022)
Attributed to:
Underpinning Power Electronics 2017: Heterogeneous Integration
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/eptc56328.2022.10013226
Publication URI: http://dx.doi.org/10.1109/eptc56328.2022.10013226
Type: Conference/Paper/Proceeding/Abstract