Defect formation and mitigation in Cu/Cu joints formed through transient liquid phase bonding with Cu-Sn nanocomposite interlayer (2022)

First Author: Jiang H

Attributed to: Underpinning Multi-User Equipment funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2022.114681

Publication URI: http://dx.doi.org/10.1016/j.microrel.2022.114681

Type: Journal Article/Review

Parent Publication: Microelectronics Reliability