A Step-by-step Modelling Approach for SiC Half-bridge Modules Considering Temperature Characteristics (2020)

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/ecce44975.2020.9235594

Publication URI: http://dx.doi.org/10.1109/ecce44975.2020.9235594

Type: Conference/Paper/Proceeding/Abstract