Nucleation and growth of Ag3Sn in Sn-Ag and Sn-Ag-Cu solder alloys (2023)

First Author: Cui Y
Attributed to:  High Reliability Interconnects: New Methodologies for Lead-free Solders funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.actamat.2023.118831

Publication URI: http://dx.doi.org/10.1016/j.actamat.2023.118831

Type: Journal Article/Review

Parent Publication: Acta Materialia