In Situ Contact Pressure Monitoring of Press Pack Power Module Using FBG Sensors (2022)

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tim.2022.3193950

Publication URI: http://dx.doi.org/10.1109/tim.2022.3193950

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Instrumentation and Measurement