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Microstructure transformation and mechanical properties of Al alloy joints soldered with Ni-Cu foam/Sn-3.0Ag-0.5Cu (SAC305) composite solder (2022)

First Author: Xiong C

Attributed to: Novel Active Soldering; Creating Enhanced joints Near-ambient Temperature (NASCENT) funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.jallcom.2022.166135

Publication URI: http://dx.doi.org/10.1016/j.jallcom.2022.166135

Type: Journal Article/Review

Parent Publication: Journal of Alloys and Compounds