Microstructure transformation and mechanical properties of Al alloy joints soldered with Ni-Cu foam/Sn-3.0Ag-0.5Cu (SAC305) composite solder (2022)
Attributed to:
Novel Active Soldering; Creating Enhanced joints Near-ambient Temperature (NASCENT)
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.jallcom.2022.166135
Publication URI: http://dx.doi.org/10.1016/j.jallcom.2022.166135
Type: Journal Article/Review
Parent Publication: Journal of Alloys and Compounds