Design of higher temperature copper brazing filler metals with reduced brittle phase content (2023)

First Author: Hardwick L
Attributed to:  Novel Active Soldering; Creating Enhanced joints Near-ambient Temperature (NASCENT) funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.mtcomm.2023.105524

Publication URI: http://dx.doi.org/10.1016/j.mtcomm.2023.105524

Type: Journal Article/Review

Parent Publication: Materials Today Communications