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A Low Inductance Power Module Packaging Design for High Performance Inverter Using SiC MOSFETs in Automotive Applications (2022)

First Author: Haiyong Wan

Attributed to: Prosperity Partnerships funded by UUI

Abstract

No abstract provided

Bibliographic Information

Publication URI: https://ieeexplore.ieee.org/document/9936546

Type: Conference/Paper/Proceeding/Abstract