A Low Inductance Power Module Packaging Design for High Performance Inverter Using SiC MOSFETs in Automotive Applications (2022)

First Author: Wan H

Attributed to: Prosperity Partnerships funded by UUI

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/wipdaeurope55971.2022.9936546

Publication URI: http://dx.doi.org/10.1109/wipdaeurope55971.2022.9936546

Type: Conference/Paper/Proceeding/Abstract