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X-Ray Imaging of Complex Flow Patterns during Tungsten Inert Gas Welding (2022)

First Author: Wu F

Attributed to: Quasi-ambient bonding to enable cost-effective high temperature Pb-free solder interconnects funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1007/s11665-022-07042-6

Publication URI: http://dx.doi.org/10.1007/s11665-022-07042-6

Type: Journal Article/Review

Parent Publication: Journal of Materials Engineering and Performance

Issue: 9