X-Ray Imaging of Complex Flow Patterns during Tungsten Inert Gas Welding (2022)
Attributed to:
Quasi-ambient bonding to enable cost-effective high temperature Pb-free solder interconnects
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1007/s11665-022-07042-6
Publication URI: http://dx.doi.org/10.1007/s11665-022-07042-6
Type: Journal Article/Review
Parent Publication: Journal of Materials Engineering and Performance
Issue: 9