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Thin SI Sensors on Flexible Printed Circuits - Study of Two Bond Methods (2021)

First Author: Schneider A.

Attributed to: Nuclear Physics Consolidated Grant 2020 funded by STFC

Abstract

No abstract provided

Bibliographic Information

Publication URI: https://api.elsevier.com/content/abstract/scopus_id/85125853777

Type: Other

Parent Publication: 2021 23rd European Microelectronics and Packaging Conference and Exhibition, EMPC 2021