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A correlative approach to observing the thermomechanically driven microstructural evolution of ultrasonically bonded copper wires (2018)

First Author: Mouawad B.

Attributed to: Underpinning Power Electronics 2012: Hub funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Publication URI: https://api.elsevier.com/content/abstract/scopus_id/85096559468

Type: Other

Parent Publication: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems