A correlative approach to observing the thermomechanically driven microstructural evolution of ultrasonically bonded copper wires (2018)

First Author: Mouawad B.
Attributed to:  Underpinning Power Electronics 2012: Hub funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Publication URI: https://api.elsevier.com/content/abstract/scopus_id/85096559468

Type: Other

Parent Publication: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems