A non-destructive study of crack development during thermal cycling of Al wire bonds using x-ray computed tomography (2014)
Attributed to:
Underpinning Power Electronics 2012: Hub
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Publication URI: https://api.elsevier.com/content/abstract/scopus_id/85084023656
Type: Other
Parent Publication: CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems, Proceedings