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Ag3Sn Morphology Transitions During Eutectic Growth in Sn-Ag Alloys (2023)

First Author: Hou N

Attributed to: High Reliability Interconnects: New Methodologies for Lead-free Solders funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1007/s11661-022-06937-2

Publication URI: https://api.elsevier.com/content/abstract/scopus_id/85147031042

Type: Journal Article/Review

Parent Publication: Metallurgical and Materials Transactions A

Issue: 3