Reliability investigation of Via-bridges for flexible electronics (2019)

First Author: Neto J
Attributed to:  Engineering Fellowships for Growth: Printable Tactile Skin funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/fleps.2019.8792275

Publication URI: https://api.elsevier.com/content/abstract/scopus_id/85071360123

Type: Conference/Paper/Proceeding/Abstract