Challenges of Junction Temperature Sensing in SiC Power MOSFETs (2019)
Attributed to:
Reliability, Condition Monitoring and Health Management Technologies for WBG Power Modules
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Publication URI: https://api.elsevier.com/content/abstract/scopus_id/85071624759
Type: Other
Parent Publication: ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia