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Challenges of Junction Temperature Sensing in SiC Power MOSFETs (2019)

First Author: Gonzalez J.O.

Attributed to: Reliability, Condition Monitoring and Health Management Technologies for WBG Power Modules funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Publication URI: https://api.elsevier.com/content/abstract/scopus_id/85071624759

Type: Other

Parent Publication: ICPE 2019 - ECCE Asia - 10th International Conference on Power Electronics - ECCE Asia