Parametric nano-electrical analysis for SiC junctions of a packaged device (2022)

First Author: Germanicus R

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/wipdaeurope55971.2022.9936397

Publication URI: https://api.elsevier.com/content/abstract/scopus_id/85142499895

Type: Conference/Paper/Proceeding/Abstract