Vacuum Thermoforming for Packaging Flexible Electronics and Sensors in E-Textiles (2023)

First Author: Valavan A
Attributed to:  Wearable and Autonomous Computing for Future Smart Cities: A Platform Grant funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tcpmt.2023.3283015

Publication URI: http://dx.doi.org/10.1109/tcpmt.2023.3283015

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Components, Packaging and Manufacturing Technology

Issue: 5