Developing a Wafer Level Gold-Polysilicon Eutectic Bond Process to Protect Sensitive Electronic Devices (2010)
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1149/1.3483496
Publication URI: http://dx.doi.org/10.1149/1.3483496
Type: Journal Article/Review
Parent Publication: ECS Transactions
Issue: 4