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Heat transfer in phase change materials for integrated batteries and power electronics systems (2023)

First Author: Zhang L

Attributed to: Quasi-ambient bonding to enable cost-effective high temperature Pb-free solder interconnects funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.applthermaleng.2023.120997

Publication URI: http://dx.doi.org/10.1016/j.applthermaleng.2023.120997

Type: Journal Article/Review

Parent Publication: Applied Thermal Engineering