Development of micron-sized Cu-Ag composite paste for oxidation-free bare Cu bonding in air condition and its deterioration mechanism during aging and power cycling tests (2023)

First Author: Chen C
Attributed to:  Underpinning Power Electronics 2017: Heterogeneous Integration funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.jmrt.2023.05.104

Publication URI: http://dx.doi.org/10.1016/j.jmrt.2023.05.104

Type: Journal Article/Review

Parent Publication: Journal of Materials Research and Technology