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Towards a wireless micropackaged implant with hermeticity monitoring (2022)

First Author: Jaccottet A.

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/biocas54905.2022.9948556

Publication URI: http://dx.doi.org/10.1109/biocas54905.2022.9948556

Type: Other

Parent Publication: BioCAS 2022 - IEEE Biomedical Circuits and Systems Conference: Intelligent Biomedical Systems for a Better Future, Proceedings