Towards a wireless micropackaged implant with hermeticity monitoring (2022)
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/biocas54905.2022.9948556
Publication URI: http://dx.doi.org/10.1109/biocas54905.2022.9948556
Type: Other
Parent Publication: BioCAS 2022 - IEEE Biomedical Circuits and Systems Conference: Intelligent Biomedical Systems for a Better Future, Proceedings