Quantification of cracked area in thermal path of high-power multi-chip modules using transient thermal impedance measurement (2016)
Attributed to:
Transformation of the Top and Tail of Energy Networks
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2016.01.002
Publication URI: http://dx.doi.org/10.1016/j.microrel.2016.01.002
Type: Journal Article/Review
Parent Publication: Microelectronics Reliability