Quantification of cracked area in thermal path of high-power multi-chip modules using transient thermal impedance measurement (2016)

First Author: Eleffendi M
Attributed to:  Transformation of the Top and Tail of Energy Networks funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2016.01.002

Publication URI: http://dx.doi.org/10.1016/j.microrel.2016.01.002

Type: Journal Article/Review

Parent Publication: Microelectronics Reliability