Limits to Hole Mobility and Doping in Copper Iodide (2023)

First Author: Willis J

Attributed to: Donor Design for Maximum Mobility TCOs funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1021/acs.chemmater.3c01628

Publication URI: http://dx.doi.org/10.1021/acs.chemmater.3c01628

Type: Journal Article/Review

Parent Publication: Chemistry of Materials

Issue: 21