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Limits to Hole Mobility and Doping in Copper Iodide. (2023)

First Author: Willis J

Attributed to: Tier 2 Hub in Materials and Molecular Modelling funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1021/acs.chemmater.3c01628

PubMed Identifier: 38027540

Publication URI: http://europepmc.org/abstract/MED/38027540

Type: Journal Article/Review

Volume: 35

Parent Publication: Chemistry of materials : a publication of the American Chemical Society

Issue: 21

ISSN: 0897-4756