Development of Micron-Sized Cu-Ag Composite Paste for Oxidation-Free Bare Cu Bonding in Air Condition and its Deterioration Mechanism During Aging and Power Cycling Tests (2023)

First Author: Chen C
Attributed to:  Underpinning Power Electronics 2017: Heterogeneous Integration funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.2139/ssrn.4374242

Publication URI: http://dx.doi.org/10.2139/ssrn.4374242

Type: Preprint