Thermo-physical characteristics of 3C-SiC structure subjected to microwave exposure: A molecular dynamics study (2023)
Attributed to:
EPSRC NetworkPlus In Digitalised Surface Manufacturing: Towards "World's Best" Processes
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.mtcomm.2023.105693
Publication URI: http://dx.doi.org/10.1016/j.mtcomm.2023.105693
Type: Journal Article/Review
Parent Publication: Materials Today Communications