Microstructurally-sensitive fatigue crack nucleation in a Zircaloy-4 alloy (2023)

First Author: Wan W
Attributed to:  High Reliability Interconnects: New Methodologies for Lead-free Solders funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.jmps.2023.105417

Publication URI: http://dx.doi.org/10.1016/j.jmps.2023.105417

Type: Journal Article/Review

Parent Publication: Journal of the Mechanics and Physics of Solids