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Life cycle analysis on sequential recovery of copper and gold from waste printed circuit boards. (2023)

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.wasman.2023.10.008

PubMed Identifier: 37837909

Publication URI: http://europepmc.org/abstract/MED/37837909

Type: Journal Article/Review

Volume: 171

Parent Publication: Waste management (New York, N.Y.)

ISSN: 0956-053X