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Damage Mechanics-Based Failure Prediction of Wirebond in Power Electronic Module (2024)

First Author: Rajaguru P

Attributed to: Closed Loop Digitalised Data Analytics and Analysis Platform (DAAP) for Intelligent Design and Manufacturing of Power Electronic Modules funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/access.2023.3342689

Publication URI: http://dx.doi.org/10.1109/access.2023.3342689

Type: Journal Article/Review

Parent Publication: IEEE Access