Impact of thinning the GaN buffer and interface layer on thermal and electrical performance in GaN-on-diamond electronic devices (2019)
Attributed to:
Integrated GaN-Diamond Microwave Electronics: From Materials, Transistors to MMICs
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.7567/1882-0786/aaf4ee
Publication URI: http://dx.doi.org/10.7567/1882-0786/aaf4ee
Type: Journal Article/Review
Parent Publication: Applied Physics Express
Issue: 2
ISSN: 18820786 18820778