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3D integrated electronics with layer by layer printing of NWs (2019)

First Author: Liu F

Attributed to: 'Hetero-print': A holistic approach to transfer-printing for heterogeneous integration in manufacturing funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/fleps.2019.8792252

Publication URI: http://dx.doi.org/10.1109/fleps.2019.8792252

Type: Conference/Paper/Proceeding/Abstract