A non-destructive study of crack development during thermal cycling of Al wire bonds using x-ray computed tomography (2014)

First Author: Agyakwa P.A.
Attributed to:  An Innovative Electronics Manufacturing Research Centre funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Type: Other

Parent Publication: CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems, Proceedings