Application of Imaging Techniques to Determine the Post-Yield Behaviour of the Heterogeneous Microstructure of Friction Stir Welds (2021)
Attributed to:
Quasi-ambient bonding to enable cost-effective high temperature Pb-free solder interconnects
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1007/s11340-021-00722-9
Publication URI: http://dx.doi.org/10.1007/s11340-021-00722-9
Type: Journal Article/Review
Parent Publication: Experimental Mechanics
Issue: 6
ISSN: 17412765 00144851