Microstructure evolution and interfacial bonding mechanisms of ultrasonically soldered sapphire/Al dissimilar joints using Sn-based solders (2022)

First Author: Lv J
Attributed to:  Novel Brazing Filler Metals using High Entropy Alloys funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.ceramint.2022.03.284

Publication URI: http://dx.doi.org/10.1016/j.ceramint.2022.03.284

Type: Journal Article/Review

Parent Publication: Ceramics International

Issue: 14

ISSN: 02728842