An evaluation of Cu-to-Cu ultrasonic welding bond through thermal cycling (2022)
Attributed to:
Reliability, Condition Monitoring and Health Management Technologies for WBG Power Modules
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Type: Other
Volume: 2022-March
Parent Publication: ETG-Fachbericht
Issue: 165
ISSN: 03413934