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An evaluation of Cu-to-Cu ultrasonic welding bond through thermal cycling (2022)

First Author: De M.

Attributed to: Reliability, Condition Monitoring and Health Management Technologies for WBG Power Modules funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Type: Other

Volume: 2022-March

Parent Publication: ETG-Fachbericht

Issue: 165

ISSN: 03413934