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Non-destructive mapping of stress and strain in soft thin films through sound waves. (2022)

First Author: Li GY

Attributed to: UK Acoustics Network funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1038/s42005-022-01000-3

PubMed Identifier: 37744302

Publication URI: http://europepmc.org/abstract/MED/37744302

Type: Journal Article/Review

Volume: 5

Parent Publication: Communications physics

ISSN: 2399-3650