Investigation of thermal effect on solidification in Sn/Cu interconnects during self-propagating exothermic reaction bonding (2022)

First Author: Liang S
Attributed to:  Underpinning Power Electronics 2017: Heterogeneous Integration funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2022.114654

Publication URI: http://dx.doi.org/10.1016/j.microrel.2022.114654

Type: Journal Article/Review

Parent Publication: Microelectronics Reliability

ISSN: 00262714